Probe card cooling assembly with direct cooling of active electronic components
View Patent ↗A probe card cooling assembly for use in a test system includes a package with one or more dies cooled by direct cooling. The cooled package includes one or more dies with active electronic components and at least one coolant port that allows a coolant to enter the high-density package and directly cool the active electronic components of the dies during a testing operation.
1. A probe card assembly component comprising:
a cooling package comprising an enclosed cavity and external electrical connections disposed outside of the cavity;
a plurality of spring probe elements electrically and mechanically disposed outside of the cavity and coupled to an outer surface of the cooling package, the spring probe elements configured to make pressure-based electrical connections with terminals of an electronic device to be tested;
a test die disposed in the cavity and electrically connected to the external electrical connections and the probe elements, the test die comprising active circuitry for testing the electronic device to be tested; and
an entrance port through which a coolant for cooling the die enters the cavity.
2. The probe assembly component of claim 1 further comprising a wiring board coupled to the cooling package and configured to connect to a tester for controlling testing of the electronic device to be tested, wherein the external electrical connections are connected to the wiring board.
3. The probe card assembly component of claim 2 further comprising an interposer disposed between the cooling package and the wiring board and electrically connecting the external electrical connections to the wiring board.
4. The probe card assembly component of claim 3 further comprising:
an exit port through which the coolant exits the cavity; and
a circulation system configured to circulate coolant through the cavity.
5. The probe card assembly component of claim 4 , wherein the test die is immersed in the coolant.
6. The probe card assembly component of claim 4 , wherein the circulation system circulates the coolant along an active surface of the test die.
7. The probe card assembly component of claim 1 , wherein the cooling package further comprises:
a first substrate, wherein the outer surface of the cooling package to which the probe elements are coupled comprises a first surface of the first substrate;
a second substrate disposed adjacent to but spaced apart from the first substrate; and
at least one seal disposed between the first substrate and the second substrate, wherein the cavity is between the first substrate, the second substrate, and the at least one seal.
8. The probe card assembly component of claim 7 , wherein the test die is physically connected to a second surface of the first substrate, which is opposite the first surface.
9. The probe card assembly component of claim 8 , wherein the test die and the probe elements are electrically connected to the external electrical connections through the first substrate.
10. The probe card assembly component of claim 8 , wherein:
the external electrical connections are disposed on the second substrate, and
the test die and the probe elements are electrically connected to the external electrical connections through the second substrate.
11. The probe card assembly component of claim 10 further comprising electrical connections within the cavity electrically connecting the first substrate and the second substrate.
12. The probe card assembly component of claim 1 further comprising:
an exit port through which the coolant exits the cavity; and
a circulation system configured to circulate coolant through the cavity.
13. The probe card assembly component of claim 12 , wherein the test die is immersed in the coolant.
14. The probe card assembly component of claim 12 , wherein the circulation system circulates the coolant along an active surface of the test die.
15. The probe card assembly component of claim 14 further comprising alignment posts coupled to an interior surface of the cavity, the test die disposed between the alignment posts, the alignment posts configured to hold by frictional contact the test die in place against the circulation of the coolant.
16. The probe card assembly component of claim 15 further comprising complaint interconnection structures disposed within the cavity and configured to hold the test die between the alignment posts.