Method and apparatus for indirect planarization
View Patent ↗Methods and apparatus for indirect planarization of a substrate are provided herein. In one embodiment, an apparatus for indirectly planarizing a probe card assembly includes an adjustment portion for controlling a force applied to a probe substrate of the probe card assembly; a force application portion configured to apply the force to the probe substrate at a location that is laterally offset from the adjustment portion; and a mechanism coupling the adjustment portion to the force application portion.
1. An apparatus for indirectly planarizing a probe card assembly, comprising:
an adjustment portion for controlling a force applied to a probe substrate of the probe card assembly, the probe substrate having probes extending from a surface of the probe substrate;
a force application portion configured to apply the force to the probe substrate at a location that is laterally offset from an axis perpendicular to the surface of the probe substrate and passing through the adjustment portion without applying the force to a location of the probe substrate that is on the axis; and
a mechanism coupling the force from the adjustment portion to the force application portion.
2. The apparatus of claim 1 , wherein the mechanism comprises a beam.
3. The apparatus of claim 2 , further comprising a flexible coupling disposed between the beam and a base for securing the beam to a reference location.
4. The apparatus of claim 3 , wherein the flexible coupling has a single rotational degree of freedom.
5. The apparatus of claim 3 , wherein the flexible coupling comprises a flexure, a spring, or a hinge.
6. The apparatus of claim 3 , further comprising at least one stop configured to limit the movement of at least one of the flexible coupling or the beam.
7. The apparatus of claim 3 , wherein the flexible coupling is backlash free.
8. The apparatus of claim 3 , wherein the flexible coupling can withstand lateral forces applied to the apparatus.
9. An apparatus for indirectly planarizing a probe card assembly, comprising:
an adjustment portion for controlling a force applied to a probe substrate of the probe card assembly;
a force application portion configured to apply the force to the probe substrate at a location that is laterally offset from one side of the adjustment portion;
a mechanism coupling the adjustment portion to the force application portion, wherein the mechanism comprises a beam; and
a flexible coupling disposed between the beam and a base for securing the beam to a reference location,
wherein the flexible coupling can withstand lateral forces applied to the apparatus, and
wherein the flexible coupling comprises a cartwheel hinge having at least one flexure configured to absorb lateral forces applied to the apparatus.
10. The apparatus of claim 2 , further comprising a flexible coupling disposed between the beam and the force application portion.
11. The apparatus of claim 10 , wherein the flexible coupling has a single rotational degree of freedom.
12. The apparatus of claim 1 , wherein the adjustment portion comprises at least one of a screw, a differential screw, a gear, a cam, a wedge, or a lever.
13. The apparatus of claim 12 , further comprising an actuator for controlling the adjustment portion.
14. The apparatus of claim 13 , wherein the actuator is driven electrically, piezoelectrically, thermally, or purely mechanically.
15. The apparatus of claim 1 , wherein the force application portion further comprises a feature configured to interface with a surface against which the force is to be applied.
16. An apparatus for indirectly planarizing a probe card assembly, comprising:
an adjustment portion for controlling a force applied to a probe substrate of the probe card assembly;
a force application portion configured to apply the force to the probe substrate at a location that is laterally offset from one side of the adjustment portion; and
a mechanism coupling the adjustment portion to the force application portion
wherein the force application portion further comprises a feature configured to interface with a surface against which the force is to be applied,
wherein the feature is a recess formed in the force application portion configured to fit over a mating protrusion disposed on the surface.
17. The apparatus of claim 2 , wherein the beam is flexibly coupled to a base.
18. The apparatus of claim 2 , wherein the beam further comprises a plurality of threaded holes disposed at different locations along the length of the beam to provide different sites to interface with the adjustment portion.
19. A probe card assembly for testing a semiconductor, comprising:
an upper portion configured to interface with a tester, the upper portion sized to fit within an interior area of the tester defined and bounded by a keepout area;
a lower portion coupled to the upper portion and having a probe interface disposed on a bottom surface of the lower portion, the lower portion larger than the interior area defined by the keepout; and
an offset adjuster for planarizing the bottom surface of the lower portion, the offset adjuster comprising:
an adjustment portion for controlling a force applied to a probe substrate of the probe card assembly, wherein the lower portion comprises the probe substrate;
a force application portion configured to apply the force to the probe substrate at a location that is laterally offset from an axis perpendicular to the bottom surface and passing through the adjustment portion without applying the force to a location of the probe substrate that is on the axis; and
a mechanism coupling the force from the adjustment portion to the force application portion;
the adjustment portion having access from the upper portion within the interior area; and
wherein the force application portion applies the force in response to control of the adjustment portion.
20. The apparatus of claim 19 , wherein the force application portion is at least partially disposed below the keepout area.
21. The apparatus of claim 19 , further comprising a plurality of offset adjusters.
22. The apparatus of claim 19 , wherein the lower portion of the probe card assembly comprises a wiring substrate, an interposer, and a probe substrate.
23. The apparatus of claim 19 , wherein the mechanism comprises a beam.
24. The apparatus of claim 23 , wherein the beam is flexibly coupled to a base.
25. The apparatus of claim 23 , wherein the beam further comprises a plurality of threaded holes disposed at different locations along the length of the beam to provide different sites to interface with the adjustment portion.
26. The apparatus of claim 23 , further comprising a flexible coupling disposed between the beam and a base for securing the beam to a reference location.
27. The apparatus of claim 26 , wherein the flexible coupling has a single rotational degree of freedom.
28. The apparatus of claim 26 , wherein the flexible coupling comprises a flexure, a spring, or a hinge.
29. The apparatus of claim 26 , further comprising at least one stop configured to limit the movement of at least one of the flexible coupling or the beam.
30. The apparatus of claim 26 , wherein the flexible coupling is backlash free.
31. The apparatus of claim 26 , wherein the flexible coupling can withstand lateral forces applied to the apparatus.
32. The apparatus of claim 31 , wherein the flexible coupling comprises a cartwheel hinge having at least one flexure configured to absorb lateral forces applied to the apparatus.
33. The apparatus of claim 19 , further comprising a flexible coupling disposed between the beam and the force application portion.
34. The apparatus of claim 33 , wherein the flexible coupling has a single rotational degree of freedom.
35. The apparatus of claim 19 , wherein the adjustment portion comprises at least one of a screw, a differential screw, a gear, a cam, a wedge, or a lever.
36. The apparatus of claim 35 , further comprising an actuator for controlling the adjustment portion.
37. The apparatus of claim 36 , wherein the actuator is driven electrically, piezoelectrically, thermally, or purely mechanically.
38. The apparatus of claim 19 , wherein the force application portion further comprises a feature configured to interface with an opposing surface to which the force is to be applied.
39. The apparatus of claim 38 , wherein the feature is a recess formed in the force application portion configured to fit over a mating protrusion disposed on the opposing surface.
40. The apparatus of claim 1 , wherein:
the mechanism comprises a beam disposed between the adjustment portion and the probe substrate, and a first hinge rotatably coupling a first end of the beam to the probe substrate; and
the adjustment portion is configured to selectively rotate the beam about the first hinge.
41. The apparatus of claim 40 further comprising a substrate, the beam being disposed between the substrate and the probe substrate, wherein:
the mechanism further comprises a second hinge that rotatably couples a second end of the beam opposite the first end to the substrate; and
the adjustment portion is further configured to selectively rotate the beam about the second hinge.
42. The apparatus of claim 41 , wherein the adjustment portion comprises a screw configured to apply a force to a location of the beam between the first end and the second end.
43. The apparatus of claim 1 , wherein:
the adjustment portion is adjustable to selectively set a level of the force, and
substantially all of the level of the force set by the adjustment portion is coupled by the mechanism to the force application portion.