Re-assembly process for MEMS structures
Methods of fabricating an array of aligned microstructures on a substrate are disclosed. The microstructures may be spring contacts or other microelements. The methods disclosed include construction of an alignment substrate, alignment of die elements with the alignment substrate, and fixation of the aligned die elements to a backing substrate.
1 - 19 . (canceled)
20 . An array of microstructures comprising:
a plurality of tested and functional dice each having a microstructure and a substrate guide mark thereon;
a master having a plurality of master guide marks; and
alignment members in alignment with said master guide marks and corresponding substrate guide marks to provide an array of dice at predetermined locations.
21 . The array of claim 20 further comprising a structural backing fixed to said array of dice to hold said array in position at said predetermined locations.
22 . The array of claim 20 wherein microstructures are positioned between said dice and said master and wherein said master is removable from engagement with said dice via said alignment member.
23 . The array of claim 22 wherein said master comprises a plurality of dice fixed to a structural backing.
24 . The array of claim 23 wherein said substrate guide marks comprise indentations in said dice adapted to receive generally frusto-spherical portions of an alignment member.
25 . The array of claim 24 wherein said alignment members comprise discreet spherically shaped elements.
26 . The array of claim 25 wherein said microstructures comprise microelectromechanical systems (MEMS) structures.
27 . The array of claim 25 wherein said microstructures comprise spring contacts.
28 . The array of claim 20 wherein said microstructures comprise tip structures secured to a plurality of probe elements.
29 . The array of claim 20 wherein said substrate guide marks comprise indentations in said dice adapted to receive generally frusto-spherical portions of an alignment member.
30 . The array of claim 20 wherein said alignment members comprise discreet spherically shaped elements.
31 . The array of claim 20 wherein said microstructures comprise microelectromechanical systems (MEMS) structures.
32 . The array of claim 20 wherein said microstructures comprise spring contacts.
33 . The array of claim 20 wherein said master comprises a plurality of dice fixed to a structural backing.
34 . The array of claim 20 , wherein at least one of said dice includes at least one electronic circuit element.
35 . The array of claim 34 , wherein said at least one electronic circuit element is one of a transistor, diode, resistor, or capacitor.
36 . The array of claim 35 , wherein said at least one die includes a plurality of said circuit elements, wherein at least one of said electronic circuit elements is integrated into said at least one die.