Spring interconnect structures
View Patent ↗An interconnection element of a spring (body) including a first resilient element with a first contact region and a second contact region and a first securing region and a second resilient element, with a third contact region and a second securing region. The second resilient element is coupled to the first resilient element through respective securing regions and positioned such that upon sufficient displacement of the first contact region toward the second resilient element, the second contact region will contact the third contact region. The interconnection, in one aspect, is of a size suitable for directly contacting a semiconductor device. A large substrate with a plurality of such interconnection elements can be used as a wafer-level contactor. The interconnection element, in another aspect, is of a size suitable for contacting a packaged semiconductor device, such as in an LGA package.
1. An electronic component comprising:
a substrate comprising a surface;
an electrically conductive terminal disposed on said surface; and
an electrically conductive interconnection element coupled to said terminal,
wherein said interconnection element comprises:
a post coupled to said terminal and extending away from said surface of said substrate;
a cantilevered body with a hollow interior, said body extending away from said post from a fixed end of said body disposed at said post to a free end of said body opposite said fixed end; and
a tip structure extending from said free end of said body away from said surface of said substrate.
2. The electronic component of claim 1 , wherein:
said body is a spring configured to deflect toward said surface of said substrate in response to a force on said tip structure arising when a terminal of an electronic device is pressed against said tip structure; and
said body has said hollow interior while said body is deflected and while is not deflected.
3. The electronic component of claim 2 , wherein, whether said body is deflected or not deflected, said body completely encloses said hollow interior in a plane that is perpendicular to said surface of said substrate and parallel to a length of said body from said fixed end to said free end.
4. The electronic component of claim 2 , wherein, whether said body is deflected or not deflected, said hollow interior is completely enclosed on four sides by said body.
5. The electronic component of claim 4 , wherein said four sides include two pairs of opposite sides.
6. The electronic component of claim 2 , wherein:
said body comprises parallel leaves extending along a length of said body from said fixed end to said free end and parallel supports disposed between said leaves at said fixed end and said free end, and
said hollow interior is between said parallel leaves and said parallel supports.
7. The electronic component of claim 2 , wherein, while said body is undeflected:
said post extends from said terminal generally perpendicular to said surface of said substrate;
said body extends from said post generally parallel to said surface of said substrate; and
said tip structure extends from said body generally perpendicular to said surface of said substrate.
8. The electronic component of claim 2 , wherein:
said terminal of said electronic device is a bond pad of a semiconductor die; and
said interconnection element is sized to contact said bond pad.
9. The electronic component of claim 1 , wherein, whether said body is deflected or not deflected, said body completely encloses said hollow interior in a plane that is perpendicular to said surface of said substrate and parallel to a length of said body from said fixed end to said free end.
10. The electronic component of claim 1 , wherein, whether said body is deflected or not deflected, said hollow interior is completely enclosed on four sides by said body.
11. The electronic component of claim 10 , wherein said four sides include two pairs of opposite sides.
12. The electronic component of claim 1 , wherein:
said body comprises parallel leaves extending along a length of said body from said fixed end to said free end and parallel supports disposed between said leaves at said fixed end and said free end, and
said hollow interior is between said parallel leaves and said parallel supports.
13. The electronic component of claim 1 , wherein, while said body is undeflected:
said post extends from said terminal generally perpendicular to said surface of said substrate;
said body extends from said post generally parallel to said surface of said substrate; and
said tip structure extends from said body generally perpendicular to said surface of said substrate.
14. The electronic component of claim 1 , wherein said interconnection element is sized for said tip structure to contact a bond pad of a semiconductor die.