Granted Patent
Utility
US 6,627,980 · App. 09/833,369
Stacked semiconductor device assembly with microelectronic spring contacts
Inventor:
Benjamin N. Eldridge
Patented Case
View Patent ↗
Granted: Sep 30, 2003
Filed: Apr 12, 2001
Inventor
Benjamin N. Eldridge
Assignee (at issue)
FormFactor, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.