Apparatuses and methods for cleaning test probes
View Patent ↗Apparatuses and methods for cleaning test probes used in a semiconductor testing machine of the type having a plurality of test probes configured to contact the surface of a semiconductor wafer to test one or more dies formed thereon. In one embodiment, the apparatus includes a roller-support arm and a cylindrical roller supported by the roller-support arm. The roller has an outer surface comprising a sticky material. Debris on the probes will adhere to the sticky material as roller is rolled across tips of the probes. The probes are thereby cleaned.
1. A method for cleaning test probes configured to contact the surface of a semiconductor wafer to test one or more dies formed thereon, the method comprising the steps of:
(a) maneuvering a roller having a sticky outer surface such that the sticky outer surface is engaged against tips of the probes; and
(b) rolling the sticky outer surface along the tips of the probes to thereby transfer debris adhering to the probes to the sticky outer surface.
2. The method of claim 1 , further comprising the following step prior to step (a): loosening the debris by scraping the tips of the probes against an abrasive surface.
3. The method of claim 2 , wherein the loosening step comprises the following steps:
maneuvering a second roller having an abrasive outer surface such that the abrasive outer surface is engaged against the tips of the probes; and
rolling the abrasive outer surface along the tips of the probes to thereby loosen the debris from the probes.
4. The method of claim 2 , wherein the loosening step comprises maneuvering an abrasive surface in a horizontal direction along the tips of the probes to thereby loosen the debris from the probes.
5. The method of claim 2 , wherein the loosening step comprises repeatedly moving an abrasive surface in a vertical direction against and away from the tips of the probes to thereby loosen the debris from the probes.
6. The method of claim 1 , further comprising the following step prior to step (a):
loosening the debris by brushing the tips of the probes against a bristled surface.
7. The method of claim 6 , wherein the loosening step comprises the following steps:
maneuvering a second cylindrical roller having a bristled outer surface such that the bristled outer surface is engaged against the tips of the probes; and
rolling the bristled outer surface along the tips of the probes to thereby loosen the debris from the probes.
8. The method of claim 6 , wherein the loosening step comprises maneuvering a bristled surface in a horizontal direction along the tips of the probes to thereby loosen the debris from the probes.
9. The method of claim 1 , wherein the probes being cleaned comprise at least one of the following: needles; vertical probes; cobra probes; L-type probes; plunger probes; spring probes; and contact bump probes formed on a membrane.
10. A method for cleaning test probes configured to contact the surface of a semiconductor wafer to test one or more dies formed thereon, the method comprising the steps of:
(a) maneuvering a roller having an outer surface such that the outer surface is engaged against tips of the probes; and
(b) rolling the outer surface along the tips of the probes to thereby clean the probes.