Patent Assignment
Reel/Frame 029342/0523
Assignment of Assignor's Interest
Recorded: 2012-11-22
Pages: 3
Assignee
SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORP
18 ZHANGJIANG ROAD, PUDONG NEW AREA, SHANGHAI, 201203, CHINA
Covered Property
(1)
Ic Device Including Package Structure and Method of Forming the Same