Patent Assignment
Reel/Frame 029349/0504
Corrective Assignment to Correct the Typographical Error of the Signature Date of the Second Inventor Previously Recorded on Reel 029331 Frame 0731. Assignor(S) Hereby Confirms the Assignment of the Assignors Interest.
Recorded: 2012-11-26
Pages: 6
Assignors
CHUNG, EUN-KYUN
Executed: 2012-11-18
RYU, JAE-SUNG
Executed: 2012-11-19
TARK, YONG-DEOK
Executed: 2012-11-19
Assignee
HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG
HERAEUSSTRASSE 12-14, HANAU, D-63450, GERMANY
Covered Property
(1)
Bonding Wire for Semiconductor Devices
Application:
13/680,871 →
Publication:
US 2013/0126934
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 20, 2012
From: CHUNG, EUN-KYUN; RYU, JAE-SUNG; TARK, YONG-DEOK
To: HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG
Reel/Frame 029331/0731 →
Change of Name
May 19, 2015
From: HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG
To: HERAEUS DEUTSCHLAND GMBH & CO. KG
Reel/Frame 035744/0381 →