Patent Assignment
Reel/Frame 029362/0231
Assignment of Assignor's Interest
Recorded: 2012-11-28
Pages: 4
Assignors
YU, CHEN-HUA
Executed: 2012-10-19
LEE, CHIEN-HSUN
Executed: 2012-10-17
CHENG, JUNG WEI
Executed: 2012-10-24
WANG, TSUNG-DING
Executed: 2012-10-17
CHENG, MING-DA
Executed: 2012-10-17
CHEN, YUNG CHING
Executed: 2012-10-30
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Molded Underfilling for Package on Package Devices