Patent Assignment
Reel/Frame 029366/0857
Assignment of Assignor's Interest
Recorded: 2012-11-28
Pages: 4
Assignors
SAITO, MASAKO
Executed: 2012-11-09
HIRATSUKA, ICHIRO
Executed: 2012-11-09
WADA, MASAHIRO
Executed: 2012-11-09
CHIBA, RYOTA
Executed: 2012-11-09
KANAZAWA, TAKUYA
Executed: 2012-11-09
YOSHIOKA, OSAMU
Executed: 2012-11-09
TSUKAMOTO, TAKEHITO
Executed: 2012-11-09
TODA, JUNKO
Executed: 2012-11-09
Assignee
ADEKA CORPORATION
2-35, HIGASHIOGU 7-CHOME, ARAKAWA-KU, TOKYO, 116-8554, JAPAN
Covered Property
(1)
Silicon-Containing Curable Composition, Cured Product of the Silicon-Containing Curable Composition and Lead Frame Substrate Formed of the Silicon-Containing Curable Composition