Patent Assignment
Reel/Frame 029383/0094
Assignment of Assignor's Interest
Recorded: 2012-11-30
Pages: 3
Assignors
WEI, CHENG-CHANG
Executed: 2012-03-29
YANG, SU-CHUN
Executed: 2012-03-29
CHEN, HSIAO-YUN
Executed: 2012-03-29
TUNG, CHIH-HANG
Executed: 2012-03-29
SHIH, DA-YUAN
Executed: 2012-04-09
YU, CHEN-HUA
Executed: 2012-03-29
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Solder Bump Stretching Method
Application:
13/406,198 →
Publication:
US 2013/0221074