Patent Assignment
Reel/Frame 029388/0700
Assignment of Assignor's Interest
Recorded: 2012-11-30
Pages: 2
Assignors
TSAI, CHENG-HSIUNG
Executed: 2012-11-14
LEE, CHUNG-JU
Executed: 2012-11-14
BAO, TIEN-I
Executed: 2012-11-14
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Air-Gap Formation in Interconnect Structures