Assignment of Assignor's Interest

Recorded: 2012-12-03 Pages: 4

Assignor

INATANI, YUJI

Executed: 2012-10-24

Assignee

FUJIKURA LTD.

1-5-1, KIBA, KOTO-KU, TOKYO, 135-8512, JAPAN

Covered Property (1)

Method of Manufacturing Multi-Layer Circuit Board, and Multi-Layer Circuit Board

Patent: 8,884,166 →

Application: 13/644,888 →

Publication: US 2013/0098662

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.