Patent Assignment
Reel/Frame 029410/0063
Assignment of Assignor's Interest
Recorded: 2012-12-05
Pages: 4
Assignor
LEE, JONG-WOO
Executed: 2012-12-05
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Apparatus and Method for Providing Interface Between Modem and Rf Chip