IP Library Assignment 029414/0846
Patent Assignment
Reel/Frame 029414/0846

Assignment of Assignor's Interest

Recorded: 2012-12-06 Pages: 2
Assignors
KATOU, SADAAKI
Executed: 2012-11-20
KAMEI, JUNICHI
Executed: 2012-11-20
Assignee
HITACHI CHEMICAL COMPANY, LTD.
1-1, NISHI-SHINJUKU 2-CHOME, SHINJUKU-KU, TOKYO, 1630449, JAPAN
Covered Property (1)
Photosensitive Resin Composition, Photosensitive Film, Rib Pattern Formation Method, Hollow Structure and Formation Method for Same, and Electronic Component
Patent: 9,005,853 →
Application: 13/698,374 →
Publication: US 2013/0076458
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →