Patent Assignment
Reel/Frame 029470/0555
Assignment of Assignor's Interest
Recorded: 2012-12-14
Pages: 2
Assignors
WANG, TZU-YU
Executed: 2010-02-03
CHIU, TZU-WEI
Executed: 2010-02-03
JENG, SHIN-PUU
Executed: 2010-02-04
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Methods of Manufacturing Stress Buffer Structures in a Mounting Structure of a Semiconductor Device