Patent Assignment
Reel/Frame 029492/0439
Assignment of Assignor's Interest
Recorded: 2012-12-18
Pages: 2
Assignor
MIKI, SYOTA
Executed: 2012-11-28
Assignee
SHINKO ELECTRIC INDUSTRIES CO., LTD.
80, OSHIMADA-MACHI, NAGANO-SHI, NAGANO-KEN, 381-2287, JAPAN
Covered Property
(1)
Semiconductor Device, Semiconductor Package, and Method for Manufacturing Semiconductor Device