Patent Assignment
Reel/Frame 029495/0863
Assignment of Assignor's Interest
Recorded: 2012-12-18
Pages: 2
Assignor
NAM, JONG HYUN
Executed: 2012-12-17
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Chips Having Improved Solidity, Semiconductor Packages Including the Same and Methods of Fabricating the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.