Patent Assignment
Reel/Frame 029521/0502
Assignment of Assignor's Interest
Recorded: 2012-12-21
Pages: 7
Assignors
CHUN, SUNG-HOON
Executed: 2012-12-19
KIM, HYE-JIN
Executed: 2012-12-17
AN, SANG-HO
Executed: 2012-12-17
KIM, KYUNG-MAN
Executed: 2012-12-17
LEE, SEOK-CHAN
Executed: 2012-12-17
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Including Stacked Semiconductor Chips and a Redistribution Layer