Patent Assignment
Reel/Frame 029526/0876
Assignment of Assignor's Interest
Recorded: 2012-12-26
Pages: 2
Assignor
KITAMURA, KAZUNORI
Executed: 2012-10-01
Assignee
SAN-EI KAGAKU CO., LTD
31-16, HORIFUNE 1-CHOME, KITA-KU, TOKYO, 114-0004, JAPAN
Covered Property
(1)
Solder-Mounted Board, Production Method Therefor, and Semiconductor Device