Patent Assignment
Reel/Frame 029528/0346
Assignment of Assignor's Interest
Recorded: 2012-12-26
Pages: 4
Assignors
TSAI, YAO-JUN
Executed: 2012-11-30
HSU, CHEN-PENG
Executed: 2012-11-30
LIN, KUO-FENG
Executed: 2012-12-05
LIU, HSUN-CHIH
Executed: 2012-11-30
CHEN, JI-FENG
Executed: 2012-12-10
HU, HUNG-LIEH
Executed: 2012-11-30
SUN, CHIEN-JEN
Executed: 2012-12-10
Assignee
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
NO. 195, SEC. 4, CHUNG HSING RD., CHUTUNG, HSINCHU, 31040, TAIWAN
Covered Property
(1)
Light Emitting Diode Chip, Light Emitting Diode Package Structure, and Method for Forming the Same