IP Library › Assignment 029550/0224
Patent Assignment
Reel/Frame 029550/0224

Assignment of Assignor's Interest

Recorded: 2012-12-28 Pages: 3
Assignors
JIANG, HONGJIN
Executed: 2012-10-22
NALLANI, ARUN KUMAR C.
Executed: 2012-10-22
TAN, WEI
Executed: 2012-10-22
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Controlled Solder Height Packages and Assembly Processes
Patent: 9,960,105 →
Application: 13/631,939 →
Publication: US 2014/0091457