Patent Assignment
Reel/Frame 029563/0290
Assignment of Assignor's Interest
Recorded: 2013-01-03
Pages: 3
Assignors
CHUANG, YAO-CHUN
Executed: 2012-11-01
CHUANG, CHITA
Executed: 2012-11-01
KUO, CHEN-CHENG
Executed: 2012-12-27
CHEN, CHEN-SHIEN
Executed: 2012-11-01
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Bump on Pad (Bop) Bonding Structure