Patent Assignment
Reel/Frame 029564/0578
Assignment of Assignor's Interest
Recorded: 2013-01-04
Pages: 7
Assignors
CHUN, JIN-HO
Executed: 2012-11-23
PARK, BYUNG-LYUL
Executed: 2012-11-23
CHUNG, HYUN-SOO
Executed: 2012-11-23
CHOI, GIL-HEYUN
Executed: 2012-11-23
HWANG, SON-KWAN
Executed: 2012-11-23
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Chips Having Through Silicon Vias and Related Fabrication Methods and Semiconductor Packages