Patent Assignment
Reel/Frame 029569/0435
Assignment of Assignor's Interest
Recorded: 2013-01-04
Pages: 7
Assignors
YIM, CHOONGBIN
Executed: 2012-10-30
YU, HAE-JUNG
Executed: 2012-10-30
PARK, TAESUNG
Executed: 2012-10-30
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Package-On-Package Electronic Devices Including Sealing Layers and Related Methods of Forming the Same