Patent Assignment
Reel/Frame 029570/0054
Assignment of Assignor's Interest
Recorded: 2013-01-04
Pages: 3
Assignee
SOITEC
CHEMIN DES FRANQUES, PARC TECHNOLOGIQUE DES FONTAINES, BERNIN, 38190, FRANCE
Covered Property
(1)
Method and Apparatus for Bonding Together Two Wafers by Molecular Adhesion