Patent Assignment
Reel/Frame 029580/0487
Assignment of Assignor's Interest
Recorded: 2013-01-07
Pages: 5
Assignors
TAN, KIAH LING
Executed: 2012-12-28
FOONG, SALLY YIN LYE
Executed: 2012-12-14
CHANGHAK, LEE
Executed: 2012-12-14
LAI, CHIN NGUK
Executed: 2012-12-28
Assignee
SPANSION LLC
915 DEGUIGNE DRIVE, SUNNYVALE, CALIFORNIA, 94088-3453
Covered Property
(1)
Multi-Chip Package Assembly with Improved Bond Wire Separation
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Mar 21, 2015
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 035240/0429 →
Assignment of Assignor's Interest
Jun 9, 2015
From: SPANSION LLC
To: CYPRESS SEMICONDUCTOR CORPORATION
Reel/Frame 035872/0344 →
Assignment and Assumption of Security Interest in Intellectual Property
Oct 28, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: MUFG UNION BANK, N.A.
Reel/Frame 050896/0366 →
Corrective Assignment to Correct the 8647899 Previously Recorded on Reel 035240 Frame 0429. Assignor(S) Hereby Confirms the Security Interst.
Nov 3, 2020
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 058002/0470 →
Release of Security Interest
Mar 16, 2022
From: MUFG UNION BANK, N.A.
To: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
Reel/Frame 059410/0438 →