Patent Assignment
Reel/Frame 029587/0324
Assignment of Assignor's Interest
Recorded: 2013-01-08
Pages: 5
Assignors
BEN MOHAMED, NADIA
Executed: 2010-08-13
DELPRAT, DANIEL
Executed: 2010-08-16
CHUANG, TA KO
Executed: 2010-09-10
CITES, JEFFREY SCOTT
Executed: 2010-09-10
USENKO, ALEX
Executed: 2010-09-10
Assignee
CORNING INCORPORATED
SP-TI-03-1, CORNING, NEW YORK, 14831
Covered Property
(1)
Process of Making Semiconductor on Glass Substrates with a Stiffening Layer