Patent Assignment
Reel/Frame 029591/0776
Assignment of Assignor's Interest
Recorded: 2012-12-14
Pages: 3
Assignor
YANG, XIONG
Executed: 2012-11-22
Assignee
HUAWEI DEVICE CO., LTD.
BUILDINGB2, HUAWEI INDUSTRIAL BASE,, BANTIAN, LONGGANG DISTRICT, SHENZHEN, 518129, GUANGDONG, P.R., CHINA
Covered Property
(1)
Method for Encapsulating Semiconductor and Structure Thereof
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.