Method for encapsulating semiconductor and structure thereof
View Patent ↗Embodiments of the present invention disclose a method for encapsulating a component with plastic and its encapsulation structure, which belong to the plastic encapsulation technology field. The method includes: processing, by using the surface mounting technology, a first surface of a part to be encapsulated with plastic and/or performing die bonding on the first surface; encapsulating, with plastic, the first surface of the part to be encapsulated with plastic a second surface of the part to be encapsulated with plastic the first surface and/or performing die bonding in the second face; and encapsulating, with plastic, the second surface of the part to be encapsulated with plastic. This encapsulation structure includes a substrate, where components are fixed on an upper surface and a lower surface of the substrate, and the components on the upper surface and lower surface are all encapsulated with plastic in seal.
1. A method for encapsulating a component of a surface of a part with plastic, comprising:
processing, by using surface mounting technology, a first surface of the part to be encapsulated with plastic and/or performing die bonding on the first surface;
encapsulating, with plastic, the first surface of the part to be encapsulated with plastic which has undergone the processing performed by using the surface mounting technology and/or has undergone the die bonding;
processing, by using the surface mounting technology, a second surface of the part to be encapsulated with plastic and/or performing die bonding on the second surface, the first surface of which has undergone the encapsulating with plastic; and
encapsulating, with plastic, the second surface of the part to be encapsulated with plastic which has undergone the processing performed by using the surface mounting technology and/or has undergone the die bonding,
wherein the encapsulating the first surface with plastic comprises injecting glue to encapsulate the first surface with plastic and before the injecting of the glue:
placing the part to be encapsulated with plastic in a mold cavity of a lower mold;
combining the lower mold and an upper mold; and
vacuuming the second surface through a vacuum suction hole at the bottom of the lower mold to keep plane of the second surface smooth.
2. The method for encapsulating a component of a surface of a part with plastic according to claim 1 , wherein the injecting of the glue comprises:
injecting the glue to the first surface through a glue injection hole on the upper mold and solidating the first surface.
3. The method for encapsulating a component of a surface of a part with plastic according to claim 1 , wherein the encapsulating the second surface with plastic comprises:
placing the part to be encapsulated with plastic in the mold cavity of the lower mold, wherein the second surface of the part is processed by using the surface mounting technology and/or die bonding is performed on the second surface, placing the second surface of the part to be encapsulated with plastic under a glue injection hole on the upper mold, and combining the upper mold and the lower mold;
vacuuming the bottom of the first surface plastic that is encapsulated with plastic through the vacuum suction hole at the bottom of the lower mold to keep the plane of the bottom of the first surface plastic that is encapsulated with plastic smooth; and
injecting glue to the second surface through the glue injection hole on the upper mold and solidating the second surface.
4. The method for encapsulating a component of a surface of a part with plastic according to claim 2 , wherein the encapsulating the second surface with plastic comprises: using a dispensing manner for encapsulating the second surface with plastic.
5. The method for encapsulating a component of a surface of a part with plastic according to claim 2 , wherein the encapsulating the second surface with plastic comprises:
placing the part to be encapsulated with plastic in the mold cavity of the lower mold, wherein the second surface of the part is processed by using the surface mounting technology and/or die bonding is performed on the second surface, placing the second surface of the part to be encapsulated with plastic under the glue injection hole on the upper mold, and combining the upper mold and the lower mold;
vacuuming the bottom of the first surface plastic that is encapsulated with plastic through the vacuum suction hole at the bottom of the lower mold to keep the plane of the bottom of the first surface plastic that is encapsulated with plastic smooth; and
injecting glue to the second surface through the glue injection hole on the upper mold and solidating the second surface.
6. The method for encapsulating a component of a surface of a part with plastic according to claim 1 , wherein the first surface and/or second surface encapsulated with the plastic are in a step-like form.