Patent Assignment
Reel/Frame 029591/0841
Assignment of Assignor's Interest
Recorded: 2012-12-21
Pages: 4
Assignors
HABA, BELGACEM
Executed: 2012-11-28
CRISP, RICHARD DEWITT
Executed: 2012-12-20
ZOHNI, WAEL
Executed: 2012-11-29
Assignee
TESSERA, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Flip-Chip, Face-Up and Face-Down Wirebond Combination Package
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →