Patent Assignment
Reel/Frame 029597/0338
Assignment of Assignor's Interest
Recorded: 2013-01-09
Pages: 4
Assignors
CHUNG, HAE SOCK
Executed: 2012-12-06
LEE, BYOUNG HWA
Executed: 2012-12-18
CHAE, EUN HYUK
Executed: 2012-12-18
PARK, MIN CHEOL
Executed: 2012-12-18
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314 MAETAN 3-DONG, YEONGTONG-GU, SUWON, GYUNGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Electronic Component and Fabrication Method Thereof