IP Library Assignment 029604/0375
Patent Assignment
Reel/Frame 029604/0375

Assignment of Assignor's Interest

Recorded: 2013-01-10 Pages: 2
Assignors
GOUZU, SHUUJI
Executed: 2012-11-22
YANAGIDA, MAKOTO
Executed: 2012-11-22
Assignee
HITACHI CHEMICAL COMPANY, LTD.
1-1 NISHI-SHINJUKU 2-CHOME, SHINJUKU-KU, TOKYO, JAPAN
Covered Property (1)
Prepreg, Metal-Clad Laminate, and Printed Circuit Board
Patent: 8,980,424 →
Application: 13/700,587 →
Publication: US 2013/0126218
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →