Patent Assignment
Reel/Frame 029608/0992
Assignment of Assignor's Interest
Recorded: 2013-01-10
Pages: 2
Assignor
LEE, SEUNG YEOP
Executed: 2012-12-28
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Chip and Semiconductor Package Having the Same