IP Library › Assignment 029654/0586
Patent Assignment
Reel/Frame 029654/0586

Assignment of Assignor's Interest

Recorded: 2013-01-18 Pages: 3
Assignors
SASAOKA, SHIMPEI
Executed: 2013-01-18
NAKABAYASHI, TAKUYA
Executed: 2013-01-18
Assignee
NICHIA CORPORATION
491-100, OKA, KAMINAKA-CHO, ANAN-SHI, TOKUSHIMA, 774-8601, JAPAN
Covered Property (1)
Molded Package and Light Emitting Device
Patent: 9,357,641 →
Application: 13/744,586 →
Publication: US 2013/0187188