Patent Assignment
Reel/Frame 029661/0456
Assignment of Assignor's Interest
Recorded: 2013-01-19
Pages: 4
Assignors
OSSIMITZ, PETER
Executed: 2013-01-09
VON DAAK, MATTHIAS
Executed: 2013-01-09
BEER, GOTTFRIED
Executed: 2013-01-08
Assignee
INFINEON TECHNOLOGIES AG
AM CAMPEON 1-12, NEUBIBERG, 85579, GERMANY
Covered Property
(1)
Method of Manufacturing and Testing a Chip Package