Patent Assignment
Reel/Frame 029681/0188
Assignment of Assignor's Interest
Recorded: 2013-01-23
Pages: 7
Assignors
SHENOY, RAVINDRA V.
Executed: 2013-01-11
LAI, KWAN-YU
Executed: 2013-01-11
STEPHANOU, PHILIP JASON
Executed: 2013-01-12
VELEZ, MARIO FRANCISCO
Executed: 2013-01-14
KIM, JONGHAE
Executed: 2013-01-14
GOUSEV, EVGENI PETROVICH
Executed: 2013-01-11
Assignee
QUALCOMM MEMS TECHNOLOGIES, INC.
5775 MOREHOUSE DRIVE, SAN DIEGO, CALIFORNIA, 92121
Covered Property
(1)
Incorporation of Passives and Fine Pitch Through via for Package on Package
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.