Patent Assignment
Reel/Frame 029684/0163
Assignment of Assignor's Interest
Recorded: 2013-01-24
Pages: 7
Assignors
JIN, JEONG-GI
Executed: 2012-11-26
PARK, JEONG-WOO
Executed: 2012-11-29
CHOI, JU-IL
Executed: 2012-11-26
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Integrated Circuit Devices Including Through-Silicon-Vias Having Integral Contact Pads