Patent Assignment
Reel/Frame 029717/0323
Assignment of Assignor's Interest
Recorded: 2013-01-30
Pages: 3
Assignee
MEDIATEK INC.
NO. 1, DUSING RD. 1ST, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, TAIWAN
Covered Property
(1)
Flip Chip Package Utilizing Trace Bump Trace Interconnection