Patent Assignment
Reel/Frame 029718/0292
Assignment of Assignor's Interest
Recorded: 2013-01-30
Pages: 4
Assignee
BRIDGE SEMICONDUCTOR CORPORATION
3F, 157 LI-TE RD., PEITOU DISTRICT, TAIPEI CITY, 11259, TAIWAN
Covered Property
(1)
Thermally Enhanced Interconnect Substrate with Embedded Semiconductor Device and Built-in Stopper and Method of Making the Same