Patent Assignment
Reel/Frame 029723/0667
Assignment of Assignor's Interest
Recorded: 2013-01-30
Pages: 2
Assignee
HITACHI CHEMICAL CO., LTD.
1-1, NISHISHINJUKU 2-CHOME, SHINJUKU-KU, TOKYO, 163-0449, JAPAN
Covered Property
(1)
Cerium Oxide Slurry, Cerium Oxide Polishing Slurry and Method for Polishing Substrate Using the Same
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Address
Sep 6, 2013
From: HITACHI CHEMICAL COMPANY, LTD.
To: HITACHI CHEMICAL CO., LTD.
Reel/Frame 031171/0923 →
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →