Patent Assignment
Reel/Frame 029726/0343
Assignment of Assignor's Interest
Recorded: 2013-01-30
Pages: 2
Assignors
HU, YEN-CHANG
Executed: 2013-01-29
HSIAO, CHING-WEN
Executed: 2013-01-29
CHEN, CHEN-SHIEN
Executed: 2013-01-29
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Packaged Semiconductor Devices and Packaging Methods