Patent Assignment
Reel/Frame 029748/0194
Assignment of Assignor's Interest
Recorded: 2013-02-04
Pages: 7
Assignors
OTSUKA, TAKAYUKI
Executed: 2013-01-23
FURUKAWA, FUJIO
Executed: 2013-01-23
WADA, RYUICHI
Executed: 2013-01-23
KITAZUME, MAKOTO
Executed: 2013-01-23
KOMIYAMA, TOSHIKI
Executed: 2013-01-23
Assignee
MITSUMI ELECTRIC CO., LTD.
2-11-2, TSURUMAKI, TAMA-SHI, TOKYO, 206-8567, JAPAN
Covered Property
(1)
Electronic Component Module Including a Lead Frame and an Insulating Resin Having a Thickness Less Than or Equal to a Thickness of the Lead Frame and Method for Producing Same