Patent Assignment
Reel/Frame 029752/0053
Assignment of Assignor's Interest
Recorded: 2013-02-04
Pages: 6
Assignors
LEE, HO-JIN
Executed: 2013-01-14
LEE, KYU-HA
Executed: 2013-01-18
CHOI, GILHEYUN
Executed: 2013-01-14
CHOI, YONGSOON
Executed: 2013-01-09
KANG, PIL-KYU
Executed: 2013-01-09
PARK, BYUNG LYUL
Executed: 2013-01-14
CHUNG, HYUNSOO
Executed: 2013-01-14
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Devices Having Conductive via Structures and Methods for Fabricating the Same