Patent Assignment
Reel/Frame 029753/0946
Assignment of Assignor's Interest
Recorded: 2013-02-05
Pages: 4
Assignors
TENG, YI-CHUAN
Executed: 2013-01-30
PENG, JUNG-HUEI
Executed: 2013-01-30
TSAI, SHANG-YING
Executed: 2013-01-30
HUANG, HSIN-TING
Executed: 2013-02-01
HUNG, LI-MIN
Executed: 2013-01-30
HUANG, YAO-TE
Executed: 2013-01-30
CHO, CHIN-YI
Executed: 2013-01-30
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Method and Apparatus for a Wafer Seal Ring