Patent Assignment
Reel/Frame 029759/0183
Assignment of Assignor's Interest
Recorded: 2013-02-05
Pages: 4
Assignor
JIN, GIL-JU
Executed: 2013-01-31
Assignee
SAMSUNG MEDISON CO., LTD.
3366, HANSEO-RO, NAM-MYEON, HONGCHEON-GUN, GANGWON-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Backing Element of Ultrasonic Probe, Backing Layer of Ultrasonic Probe, and Manufacturing Method Thereof