IP Library Assignment 029775/0109
Patent Assignment
Reel/Frame 029775/0109

Assignment of Assignor's Interest

Recorded: 2013-02-07 Pages: 4
Assignor
CHAE, JUNGHUN
Executed: 2008-06-09
Assignee
THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
352 HENRY ADMINISTRATION BUILDING, 506 SOUTH WRIGHT STREET, URBANA, ILLINOIS, 61801
Covered Property (1)
High Throughput, Low Cost Dual-Mode Patterning Method for Large Area Substrates
Patent: 8,420,978 →
Application: 11/624,505 →
Publication: US 2008/0176398
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 7, 2013
From: JAIN, KANTI
To: THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS; ANVIK CORPORATION
Reel/Frame 029775/0046 →
Employment Agreement Feb 14, 2013
From: APPASAMY, SREERAM
To: ANVIK CORPORATION
Reel/Frame 029816/0603 →