IP Library Assignment 029816/0603
Patent Assignment
Reel/Frame 029816/0603

Employment Agreement

Recorded: 2013-02-14 Pages: 3
Assignor
APPASAMY, SREERAM
Executed: 2004-10-20
Assignee
ANVIK CORPORATION
6 SKYLINE DRIVE, HAWTHORNE, NEW YORK, 10532
Covered Property (1)
High Throughput, Low Cost Dual-Mode Patterning Method for Large Area Substrates
Patent: 8,420,978 →
Application: 11/624,505 →
Publication: US 2008/0176398
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 7, 2013
From: JAIN, KANTI
To: THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS; ANVIK CORPORATION
Reel/Frame 029775/0046 →
Assignment of Assignor's Interest Feb 7, 2013
From: CHAE, JUNGHUN
To: THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
Reel/Frame 029775/0109 →