Patent Assignment
Reel/Frame 029790/0455
Assignment of Assignor's Interest
Recorded: 2013-02-11
Pages: 2
Assignors
YU, CHEN-HUA
Executed: 2013-01-16
HOU, SHANG-YUN
Executed: 2013-01-16
CHIOU, WEN-CHIH
Executed: 2013-01-14
HUNG, JUI-PIN
Executed: 2013-01-14
YEH, DER-CHYANG
Executed: 2013-01-14
YEH, CHIUNG-HAN
Executed: 2013-01-14
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Package with Metal-Insulator-Metal Capacitor and Method of Manufacturing the Same