IP Library › Assignment 029797/0134
Patent Assignment
Reel/Frame 029797/0134

Assignment of Assignor's Interest

Recorded: 2013-02-12 Pages: 3
Assignor
DU, YAND
Executed: 2013-02-04
Assignee
QUALCOMM INCORPORATED
5775 MOREHOUSE DRIVE, PATENT DEPARTMENT, SAN DIEGO, CALIFORNIA, 92121-1714
Covered Property (1)
Three-Dimensional (3-D) Integrated Circuits (3DICS) with Graphene Shield, and Related Components and Methods
Patent: 9,536,840 →
Application: 13/765,061 →
Publication: US 2014/0225235
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Conveying Party Previously Recorded at Reel: 029797 Frame: 0134. Assignor(S) Hereby Confirms the Assignment. Nov 21, 2016
From: DU, YANG
To: QUALCOMM INCORPORATED
Reel/Frame 040653/0339 →
Corrective Assignment to Correct the Du, Yand Previously Recorded on Reel 029797 Frame 0134. Assignor(S) Hereby Confirms the Du, Yang. Dec 15, 2016
From: DU, YANG
To: QUALCOMM INCORPORATED
Reel/Frame 040980/0854 →